Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8531202 | Probe card test apparatus and method | Sammy Mok, Fariborz Agahdel | 2013-09-10 |
| 7884634 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin +3 more | 2011-02-08 |
| 7876087 | Probe card repair using coupons with spring contacts and separate atachment points | Sammy Mok, Fariborz Agahdel | 2011-01-25 |
| 7872482 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin +3 more | 2011-01-18 |
| 7382142 | High density interconnect system having rapid fabrication cycle | Fu Chiung Chong, Andrew Kao, Douglas McKay, Anna Litza, Douglas N. Modlin +3 more | 2008-06-03 |
| 7137830 | Miniaturized contact spring | Syamal Kumar Lahiri, Fu Chiung Chong, Sammy Mok, Erh-Kong Chieh, Roman Milter +4 more | 2006-11-21 |
| 7126220 | Miniaturized contact spring | Syamal Kumar Lahiri, Fu Chiung Chong, Sammy Mok, Erh-Kong Chieh, Roman Milter +4 more | 2006-10-24 |
| 6917525 | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs | Sammy Mok, Fu Chiung Chong, Syamal Kumar Lahiri, Joseph Haemer | 2005-07-12 |