WB

William R. Bottoms

AP Advantest (Singapore) Pte: 1 patents #12 of 43Top 30%
📍 Palo Alto, CA: #7,003 of 9,675 inventorsTop 75%
🗺 California: #247,236 of 386,348 inventorsTop 65%
Overall (All Time): #3,183,008 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8575954 Structures and processes for fabrication of probe card assemblies with multi-layer interconnect Fu Chiung Chong, Erh-Kong Chieh, Nim C. Lam 2013-11-05