Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7812626 | High density interconnect system for IC packages and interconnect assemblies | Fu Chiung Chong, Sammy Mok, Douglas N. Modlin | 2010-10-12 |
| 7579848 | High density interconnect system for IC packages and interconnect assemblies | Fu Chiung Chong, Sammy Mok, Douglas N. Modlin | 2009-08-25 |