Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structures and processes for fabrication of probe card assemblies with multi-layer interconnect

Structures and processes for fabrication of probe card assemblies with multi-layer interconnect

US Patent 8575954 · Granted Nov 5, 2013

Estimated economic value: $91,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Construction structures and manufacturing processes for integrated circuit wafer2011
High density interconnect system having rapid fabrication cycle2011
High density interconnect system having rapid fabrication cycle2011
High density interconnect system for IC packages and interconnect assemblies2010
Massively parallel interface for electronic circuit2010
Systems for testing and packaging integrated circuits2009
High density interconnect system for IC packages and interconnect assemblies2009
Massively parallel interface for electronic circuit2008
High density interconnect system having rapid fabrication cycle2008
Enhanced compliant probe card systems having improved planarity2008
Enhanced stress metal spring contactor2007
Miniaturized contact spring2006