Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6214630 | Wafer level integrated circuit structure and method of manufacturing the same | Taisheng Feng, Charlie Han | 2001-04-10 |
| 6166444 | Cascade-type chip module | Charlie Han | 2000-12-26 |
| 6031293 | Package-free bonding pad structure | Fu-Tai Liou | 2000-02-29 |
| 5875136 | Repairable memory module and method of repairing memory modules | Jerry Jaw, Charlie Han | 1999-02-23 |
| 5159630 | Facsimile message encryption system | Ling-Yuan Tseng, Sheng-wen Hong | 1992-10-27 |