Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8546739 | Manufacturing method of wafer level chip scale package of image-sensing module | Min-Chih Hsuan, Li-Che Chen | 2013-10-01 |
| 7659501 | Image-sensing module of image capture apparatus and manufacturing method thereof | Min-Chih Hsuan, Li-Che Chen | 2010-02-09 |