Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495510 | Semiconductor device package structure and method for fabricating the same | Yu-Yuan Huang, Tsung-Kai Yu, Chen-Hsiao Wang, Kai-Kuang Ho | 2022-11-08 |
| 10643911 | Scribe line structure | — | 2020-05-05 |
| 9899333 | Method for forming crack-stopping structures | — | 2018-02-20 |
| 9431350 | Crack-stopping structure and method for forming the same | — | 2016-08-30 |
| 9196549 | Method for generating die identification by measuring whether circuit is established in a package structure | — | 2015-11-24 |
| 7534653 | Chip packaging process | Min-Chih Hsuan, Kai-Kuang Ho, Kuo-Ming Chen | 2009-05-19 |