Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12387998 | QFN package and fabricating method of the same | Chiu-Feng Lee, Kai-Kuang Ho | 2025-08-12 | |
| 11848660 | Surface acoustic wave device fabrication method | Kai-Kuang Ho | 2023-12-19 | $1,222,000 |
| 11495510 | Semiconductor device package structure and method for fabricating the same | Yu-Yuan Huang, Tsung-Kai Yu, Kai-Kuang Ho, Kuang-Hui Tang | 2022-11-08 | $1,363,000 |
| 10340230 | Semiconductor chip | Tsong-Lin Shen, Sheng-Wei Hung, Chin-Tsai Chang, Hui-Lung Chou | 2019-07-02 | $179,000 |
| 9502366 | Semiconductor structure with UBM layer and method of fabricating the same | Kai-Kuang Ho, Yi-Feng Hsu | 2016-11-22 | $102,000 |