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Scribe line structure for wafer dicing and method of making the same |
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Scribe line structure for wafer dicing |
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Bond pad structure located over active circuit structure |
— |
2012-02-14 |
| 8039367 |
Scribe line structure and method for dicing a wafer |
— |
2011-10-18 |
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Integrated circuit structure and manufacturing method thereof |
— |
2011-10-04 |
| 8013425 |
Scribe line structure for wafer dicing and method of making the same |
Tsung-Shu Lin |
2011-09-06 |
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Die seal ring and wafer having the same |
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2010-09-14 |
| 7696606 |
Metal structure |
Chien-Li Kuo, Jui-Meng Jao, Hui-Ling Chen, Kai-Kuang Ho, Ching-Li Yang |
2010-04-13 |
| 7649268 |
Semiconductor wafer |
Chien-Li Kuo, Jui-Meng Jao, Hui-Ling Chen, Kai-Kuang Ho, Ching-Li Yang |
2010-01-19 |
| 7485953 |
Chip package structure |
— |
2009-02-03 |
| 7387950 |
Method for forming a metal structure |
Chien-Li Kuo, Jui-Meng Jao, Hui-Ling Chen, Kai-Kuang Ho, Ching-Li Yang |
2008-06-17 |
| 7382038 |
Semiconductor wafer and method for making the same |
— |
2008-06-03 |
| 7129574 |
Multi-power ring chip scale package for system level integration |
— |
2006-10-31 |
| 6770963 |
Multi-power ring chip scale package for system level integration |
— |
2004-08-03 |
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Guard mesh for noise isolation in highly integrated circuits |
Chinpo Chen |
2003-07-01 |
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Guard mesh for noise isolation in highly integrated circuits |
Chinpo Chen |
2002-07-23 |
