Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8755054 | Method of measuring surface structure of display device | Chih-Wei Lin, Min Wang, Yung-Cheng Chen | 2014-06-17 |
| 8605235 | Display device and method of measuring surface structure thereof | Chih-Wei Lin, Min Wang, Yung-Cheng Chen | 2013-12-10 |
| 7268440 | Fabrication of semiconductor integrated circuit chips | Zong-Huei Lin, Jui-Meng Jao, Wen-Tung Chang, Kuo-Ming Chen, Kai-Kuang Ho | 2007-09-11 |
| 7026234 | Parasitic capacitance-preventing dummy solder bump structure and method of making the same | Jui-Meng Jao, Shing-Ren Sheu, Kuo-Ming Chen, Kun-Chih Wang | 2006-04-11 |
| 7008818 | Flip chip packaging process employing improved probe tip design | Kow-Bao Chen | 2006-03-07 |
| 6881654 | Solder bump structure and laser repair process for memory device | Kuo-Ming Chen | 2005-04-19 |