Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6245380 | Method of forming bonding pad | Shih-Wei Sun, Wen-Yi Hsieh, Water Lur | 2001-06-12 |
| 6180484 | Chemical plasma treatment for rounding tungsten surface spires | Wen-Yi Hsieh | 2001-01-30 |
| 6169321 | Method and system for locally annealing a microstructure formed on a substrate and device formed thereby | Clark T.-C. Nguyen | 2001-01-02 |
| 6169028 | Method fabricating metal interconnected structure | Ming-Sheng Yang, Wen-Yi Hsieh | 2001-01-02 |
| 6080660 | Via structure and method of manufacture | Hsiao-Pang Chou, Wen-Yi Hsieh, Tri-Rung Yew | 2000-06-27 |
| 6080646 | Method of fabricating a metal-oxide-semiconductor transistor with a metal gate | — | 2000-06-27 |
| 6048796 | Method of manufacturing multilevel metal interconnect | Wen-Yi Hsieh, Yimin Huang, Chih-Chien Liu, Water Lur | 2000-04-11 |
| 6046097 | Deposition method with improved step coverage | Kevin Hsieh, Wen-Yi Hsieh | 2000-04-04 |
| 6013579 | Self-aligned via process for preventing poison via formation | Tri-Rung Yew | 2000-01-11 |
| 5976984 | Process of making unlanded vias | Coming Chen, Chih-Chien Liu, Tri-Rung Yew | 1999-11-02 |
| 5976994 | Method and system for locally annealing a microstructure formed on a substrate and device formed thereby | Clark T.-C. Nguyen | 1999-11-02 |