Home › United Microelectronics › Bing Wu

BW

Bing Wu — 32 Patents

UMUnited Microelectronics: 15 patents #405 of 4,560Top 9%

NCNational Starch And Chemical Investment Holding Copporation: 7 patents #57 of 611Top 10%

HCHangzhou Silicon-Magic Semiconductor Technology Co.: 6 patents #2 of 10Top 20%

S(Semiconductor Manufacturing International (Beijing): 1 patents #314 of 689Top 50%

S(Semiconductor Manufacturing International (Shanghai): 1 patents #574 of 1,122Top 55%

Overall (All Time): #110,428 of 4,157,543Top 3%

32 Patents All Time

Bing Wu has been granted 32 US patents while listed as an inventor at United Microelectronics. The first was granted in 1997 and the most recent in June 2025. Bing Wu ranks #110,428 of 4,157,543 US inventors in our database (top 2.7%). Patent records list Bing Wu in Ningbo City, NJ, CN.

Patents per Year

Issued Patents All Time

Showing 1–25 of 32 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12338909	Electronic control actuator, exhaust gas treatment system, and vehicle comprising exhaust gas treatment system	Zhoutong HE, Wei Wang, Kaifeng ZHOU, He Zhang	2025-06-24
12279442	LDMOS transistor and manufacturing method thereof	Jiakun Wang	2025-04-15
12176432	Trench-type MOSFET and method for manufacturing the same	Jiakun Wang	2024-12-24
11757035	LDMOS transistor and method for manufacturing the same	Chien-Ling Chan, Liang Tong	2023-09-12
11670502	SiC MOSFET and method for manufacturing the same	Jiakun Wang, Hui Chen	2023-06-06
11424344	Trench MOSFET and method for manufacturing the same	Jiakun Wang	2022-08-23
11355631	LDMOS transistor and method for manufacturing the same	Chien-Ling Chan, Liang Tong	2022-06-07
9570589	FINFET semiconductor device and fabrication method	Yonggen He	2017-02-14	$675,000
8735282	Semiconductor device and manufacturing method therefor	—	2014-05-27	$1,058,000
7372168	Semiconductor chip capable of implementing wire bonding over active circuits	Kun-Chih Wang, Mei-Ling Chao, Shiao-Shien Chen	2008-05-13	$2,386,000
7326754	Thermoset adhesive films	Nikola Nikolic, Ruzhi Zhang, Osama M. Musa, Hwail Jin, David Shenfield	2008-02-05
7304385	Semiconductor chip capable of implementing wire bonding over active circuits	Kun-Chih Wang	2007-12-04	$2,179,000
7274108	Semiconductor chip capable of implementing wire bonding over active circuits	—	2007-09-25	$2,580,000
7250670	Semiconductor structure and fabricating method thereof	Chien-Li Kuo, Jui-Meng Jao	2007-07-31	$2,175,000
7212396	Method for fabricating a thin film resistor	—	2007-05-01	$2,487,000
7208837	Semiconductor chip capable of implementing wire bonding over active circuits	Kun-Chih Wang	2007-04-24	$7,645,000
7071575	Semiconductor chip capable of implementing wire bonding over active circuits	Kun-Chih Wang, Mei-Ling Chao, Shiao-Shien Chen	2006-07-04
7056796	Method for fabricating silicide by heating an epitaxial layer and a metal layer formed thereon	—	2006-06-06	$1,300,000
7057264	Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates	Renyi Wang, Harry Richard Kuder	2006-06-06
6900541	Semiconductor chip capable of implementing wire bonding over active circuits	Kun-Chih Wang	2005-05-31	$2,302,000
6482739	Method for decreasing the resistivity of the gate and the leaky junction of the source/drain	—	2002-11-19	$1,662,000
6300189	Method for forming a metal capacitor	—	2001-10-09	$1,652,000
6277729	Method of manufacturing transistor barrier layer	Cheng-Hui Chung	2001-08-21	$721,000
6235566	Two-step silicidation process for fabricating a semiconductor device	—	2001-05-22	$1,230,000
6184118	Method for preventing the peeling of the tungsten metal after the metal-etching process	Chen-Hui Chung	2001-02-06	$1,528,000