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Bing Wu

UM United Microelectronics: 15 patents #405 of 4,560Top 9%
S( Semiconductor Manufacturing International (Beijing): 1 patents #301 of 689Top 45%
S( Semiconductor Manufacturing International (Shanghai): 1 patents #561 of 1,122Top 50%
Overall (All Time): #110,386 of 4,157,543Top 3%
32
Patents All Time

Issued Patents All Time

Showing 25 most recent of 32 patents

Patent #TitleCo-InventorsDate
12338909 Electronic control actuator, exhaust gas treatment system, and vehicle comprising exhaust gas treatment system Zhoutong HE, Wei Wang, Kaifeng ZHOU, He Zhang 2025-06-24
12279442 LDMOS transistor and manufacturing method thereof Jiakun Wang 2025-04-15
12176432 Trench-type MOSFET and method for manufacturing the same Jiakun Wang 2024-12-24
11757035 LDMOS transistor and method for manufacturing the same Chien-Ling Chan, Liang Tong 2023-09-12
11670502 SiC MOSFET and method for manufacturing the same Jiakun Wang, Hui Chen 2023-06-06
11424344 Trench MOSFET and method for manufacturing the same Jiakun Wang 2022-08-23
11355631 LDMOS transistor and method for manufacturing the same Chien-Ling Chan, Liang Tong 2022-06-07
9570589 FINFET semiconductor device and fabrication method Yonggen He 2017-02-14
8735282 Semiconductor device and manufacturing method therefor 2014-05-27
7372168 Semiconductor chip capable of implementing wire bonding over active circuits Kun-Chih Wang, Mei-Ling Chao, Shiao-Shien Chen 2008-05-13
7326754 Thermoset adhesive films Nikola Nikolic, Ruzhi Zhang, Osama M. Musa, Hwail Jin, David Shenfield 2008-02-05
7304385 Semiconductor chip capable of implementing wire bonding over active circuits Kun-Chih Wang 2007-12-04
7274108 Semiconductor chip capable of implementing wire bonding over active circuits 2007-09-25
7250670 Semiconductor structure and fabricating method thereof Chien-Li Kuo, Jui-Meng Jao 2007-07-31
7212396 Method for fabricating a thin film resistor 2007-05-01
7208837 Semiconductor chip capable of implementing wire bonding over active circuits Kun-Chih Wang 2007-04-24
7071575 Semiconductor chip capable of implementing wire bonding over active circuits Kun-Chih Wang, Mei-Ling Chao, Shiao-Shien Chen 2006-07-04
7057264 Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates Renyi Wang, Harry Richard Kuder 2006-06-06
7056796 Method for fabricating silicide by heating an epitaxial layer and a metal layer formed thereon 2006-06-06
6900541 Semiconductor chip capable of implementing wire bonding over active circuits Kun-Chih Wang 2005-05-31
6482739 Method for decreasing the resistivity of the gate and the leaky junction of the source/drain 2002-11-19
6300189 Method for forming a metal capacitor 2001-10-09
6277729 Method of manufacturing transistor barrier layer Cheng-Hui Chung 2001-08-21
6235566 Two-step silicidation process for fabricating a semiconductor device 2001-05-22
6184118 Method for preventing the peeling of the tungsten metal after the metal-etching process Chen-Hui Chung 2001-02-06