Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6022616 | Adhesive composition with small particle size for microelectronic devices | Timothy G. Costello, Kathy Jun | 2000-02-08 |
| 6010958 | Method for improving the planarization of dielectric layer in the fabrication of metallic interconnects | Tung-Po Chen, Hong-Tsz Pan | 2000-01-04 |
| 5856383 | Snap-cure epoxy adhesives | Quinn K. Tong, Rose Ann Schultz | 1999-01-05 |
| 5854315 | Snap-cure epoxy adhesives | Quinn K. Tong, Rose Ann Schultz | 1998-12-29 |
| 5807959 | Flexible epoxy adhesives with low bleeding tendency | Quinn K. Tong, Robert W. R. Humphreys | 1998-09-15 |
| 5770706 | Snap-cure epoxy adhesives | Quinn K. Tong, Rose Ann Schultz | 1998-06-23 |
| 5685758 | Hot melt adhesive compositions with improved wicking properties | Charles W. Paul, Matthew Sharak, Lydia Wagner, Quinn K. Tong, Gary Raykovitz | 1997-11-11 |