Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7285600 | Reagents for heat activated polymer crosslinking | Brian S. Huffman, Peter J. Schlom, James Nowicki, Ju-Ming Hung | 2007-10-23 |
| 7273916 | Fluid resistant silicone encapsulant | Elizabeth Walker, Jiazhong Luo, Katharine Louise Pearce | 2007-09-25 |
| 7241852 | Fluid resistant silicone encapsulant | Elizabeth Walker, Jiazhong Luo, Katharine Louise Pearce | 2007-07-10 |
| 6841647 | Fluid resistant silicone encapsulant | Elizabeth Walker, Jiazhong Luo, Katharine Louise Pearce | 2005-01-11 |
| 6388037 | Allylated amide compounds and die attach adhesives prepared therefrom | Donald Herr, Chaodong Xiao | 2002-05-14 |
| 6355838 | Reagents for heat activated polymer crosslinking | Brian S. Huffman, Peter J. Schlom, James Nowicki, Ju-Ming Hung | 2002-03-12 |
| 6350841 | Underfill encapsulants prepared from allylated amide compounds | Donald Herr, Chaodong Xiao | 2002-02-26 |
| 6350840 | Underfill encapsulants prepared from allylated amide compounds | Donald Herr, Chaodong Xiao | 2002-02-26 |
| 6265530 | Die attach adhesives for use in microelectronic devices | Donald Herr, Pingyong Xu, Scott R. McLaughlin | 2001-07-24 |
| 6020508 | Radiation- or thermally-initiated cationically-curable epoxide compounds and compositions made from those compounds | Nikola Nikolic | 2000-02-01 |
| 5962547 | Reactive radiation- or thermally-initiated cationically-curable epoxide monomers and compositions made from those monomers | Nikola Nikolic | 1999-10-05 |
| 5856383 | Snap-cure epoxy adhesives | Bing Wu, Quinn K. Tong | 1999-01-05 |
| 5854315 | Snap-cure epoxy adhesives | Bing Wu, Quinn K. Tong | 1998-12-29 |
| 5833755 | Starch degradation using metal-based coordination complexes | Peter J. Schlom | 1998-11-10 |
| 5783713 | Polyglycidylphenyl ethers of alkylene or alkyleneoxy chains for use in microelectronics adhesives | Steven P. Fenelli | 1998-07-21 |
| 5770706 | Snap-cure epoxy adhesives | Bing Wu, Quinn K. Tong | 1998-06-23 |
| 5723636 | Methyltrioxorhenium-urea hydrogen peroxide epoxidation of olefins | Steven P. Fenelli | 1998-03-03 |
| 5717054 | Epoxy resins consisting of flexible chains terminated with glycidyloxyphenyl groups for use in microelectronics adhesives | — | 1998-02-10 |
| 5703195 | Polyglycidylphenyl ethers of alkylene or alkyleneoxy chains for use in microelectronics adhesives | Steven P. Fenelli | 1997-12-30 |
| 5646315 | Polyglydicylphenyl ethers of alkyloxy chains for use in microelectronics adhesives | Steven P. Fenelli | 1997-07-08 |
| 5536855 | Process for preparing glycidyl esters for use in electronics adhesives | Sharon Chaplinsky | 1996-07-16 |
| 5138028 | Polyimides end-capped with diaryl substituted acetylene | Charles W. Paul, Steven P. Fenelli | 1992-08-11 |
| 5034473 | Composition of polyepoxide derived from alkoxy-substituted allylphenol and carboxy-terminated polyester or polyamide | S. Steve Chen | 1991-07-23 |