Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074142 | Semiconductor package and method of fabricating the same | Jongpa HONG, Sang-Sick Park | 2024-08-27 |
| 12040213 | Processing tape and method of fabricating a semiconductor device using the same | Seon Ho Lee, Yeongseok Kim | 2024-07-16 |
| 11842982 | Semiconductor package with curing layer between semiconductor chips | Seon Ho Lee, Jongpa HONG | 2023-12-12 |
| 10910339 | Flip chip bonding method | Yongwon Choi, Myung-Sung Kang, Yeongseok Kim, Wonkeun Kim | 2021-02-02 |
| 7326754 | Thermoset adhesive films | Nikola Nikolic, Ruzhi Zhang, Osama M. Musa, Bing Wu, David Shenfield | 2008-02-05 |