Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074142 | Semiconductor package and method of fabricating the same | Hwail Jin, Sang-Sick Park | 2024-08-27 |
| 11842982 | Semiconductor package with curing layer between semiconductor chips | Seon Ho Lee, Hwail Jin | 2023-12-12 |
| 11676925 | Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same | Jiseok Hong, Hyuekjae Lee, Jihwan Hwang, Taehun Kim | 2023-06-13 |
| 11158594 | Semiconductor packages having improved reliability in bonds between connection conductors and pads | Jiseok Hong, Hyuekjae Lee, Jihwan Hwang, Taehun Kim | 2021-10-26 |