Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12419042 | Integrated circuit device | Sangho Lee, Seoryong Park, Jiyoung Ahn, Kiseok Lee, Yoonyoung Choi +1 more | 2025-09-16 |
| 12363891 | Semiconductor device and method of fabricating the same | Sung-Jin Yeo, Yoongi Hong | 2025-07-15 |
| 11908797 | Integrated circuit device having a bit line and a main insulating spacer with an extended portion | Jiyoung Ahn, Seunguk Han, Sunghwan Kim, Seoryong Park, Kiseok Lee +2 more | 2024-02-20 |
| 11764192 | Semiconductor package including underfill material layer and method of forming the same | Jihwan Hwang, Taehun Kim, Jihwan Suh, Soyoun Lee, Hyuekjae Lee | 2023-09-19 |
| 11721673 | Semiconductor package having stacked semiconductor chips | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Soyoun Lee, Taehun Kim +1 more | 2023-08-08 |
| 11676925 | Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same | Hyuekjae Lee, Jongpa HONG, Jihwan Hwang, Taehun Kim | 2023-06-13 |
| 11658141 | Die-to-wafer bonding structure and semiconductor package using the same | Unbyoung Kang, Myungsung Kang, Taehun Kim, Sangcheon Park, Hyuekjae Lee +1 more | 2023-05-23 |
| 11647627 | Integrated circuit device | Sangho Lee, Seoryong Park, Jiyoung Ahn, Kiseok Lee, Yoonyoung Choi +1 more | 2023-05-09 |
| 11557596 | Semiconductor memory device | Seoryong Park, Seunguk Han, Jiyoung Ahn, Kiseok Lee, Yoonyoung Choi | 2023-01-17 |
| 11404395 | Semiconductor package including underfill material layer and method of forming the same | Jihwan Hwang, Taehun Kim, Jihwan Suh, Soyoun Lee, Hyuekjae Lee | 2022-08-02 |
| 11289438 | Die-to-wafer bonding structure and semiconductor package using the same | Unbyoung Kang, Myungsung Kang, Taehun Kim, Sangcheon Park, Hyuekjae Lee +1 more | 2022-03-29 |
| 11251070 | Semiconductor device including a passivation spacer and method of fabricating the same | Chan Yoon, Ilyoung Moon, Jemin Park, Kiseok Lee, Jung-Hoon Han | 2022-02-15 |
| 11244927 | Semiconductor package having stacked semiconductor chips | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Soyoun Lee, Taehun Kim +1 more | 2022-02-08 |
| 11158594 | Semiconductor packages having improved reliability in bonds between connection conductors and pads | Hyuekjae Lee, Jongpa HONG, Jihwan Hwang, Taehun Kim | 2021-10-26 |
| 10790186 | Semiconductor device including a passivation spacer and method of fabricating the same | Chan Yoon, Ilyoung Moon, Jemin Park, Kiseok Lee, Jung-Hoon Han | 2020-09-29 |
| 10410916 | Semiconductor device | Kiseok Lee, Jemin Park, Yoosang Hwang | 2019-09-10 |