Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Cross grid array package structure and method of manufacture

Cross grid array package structure and method of manufacture

US Patent 6190938 · Granted Feb 20, 2001

Estimated economic value: $1,683,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pre-process before cutting a wafer and method of cutting a wafer2007
Method for manufacturing wafer level chip scale package structure2007
Laser repair operation2004
Laser repair operation2003
Laser repair operation2003
Bonding pad structure of semiconductor device having improved bondability2002
Cross grid array package structure and method of manufacture2002
Bonding pad on a semiconductor chip2002
Method of forming a bonding pad on a semiconductor chip2002
Multi-chip semiconductor package2001
Semiconductor chip2001
Method of testing and packaging a semiconductor chip2001