Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704726 | Packaging structural member | Chin Hock Toh, Yi-Sheng Anthony Sun, Xue Ren Zhang | 2017-07-11 |
| 9142487 | Packaging structural member | Chin Hock Toh, Yi-Sheng Anthony Sun, Xue Ren Zhang | 2015-09-22 |
| 8772921 | Interposer for semiconductor package | Chin Hock Toh, Yao Huang Huang, Wei Liang Yuan, Susanto Tanary, Yi-Sheng Anthony Sun | 2014-07-08 |
| 8741762 | Through silicon via dies and packages | Hao Liu, Yi-Sheng Anthony Sun, Chin Hock Toh | 2014-06-03 |
| 8586465 | Through silicon via dies and packages | Hao Liu, Yi-Sheng Anthony Sun, Chin Hock Toh | 2013-11-19 |
| 8426246 | Vented die and package | Chin Hock Toh, Hao Liu | 2013-04-23 |
| 8399985 | Mold design and semiconductor package | Hao Liu, Chin Hock Toh | 2013-03-19 |
| 8384203 | Packaging structural member | Chin Hock Toh, Yi-Sheng Anthony Sun, Xue Ren Zhang | 2013-02-26 |
| 8143719 | Vented die and package | Chin Hock Toh, Hao Liu | 2012-03-27 |
| 8115292 | Interposer for semiconductor package | Chin Hock Toh, Yao Huang Huang, Wei Liang Yuan, Susanto Tanary, Anthony Yi Sheng Sun | 2012-02-14 |
| 8030761 | Mold design and semiconductor package | Hao Liu, Chin Hock Toh | 2011-10-04 |
| 7883938 | Stacked die semiconductor package and method of assembly | Anthony Sun-Yi Sheng, Liu Hao, Toh Chin Hock | 2011-02-08 |
| 7830006 | Structurally-enhanced integrated circuit package and method of manufacture | Hien Boon Tan, Anthony Yi Sheng Sun, Beng Kuan Lim, Krishnamoorthi Sivalingam | 2010-11-09 |