TH

Toh Chin Hock

UC United Test And Assembly Center: 1 patents #30 of 65Top 50%
📍 Singapore, SG: #6,661 of 13,971 inventorsTop 50%
Overall (All Time): #3,239,852 of 4,157,543Top 80%
1
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Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7883938 Stacked die semiconductor package and method of assembly Ravi Kanth Kolan, Anthony Sun-Yi Sheng, Liu Hao 2011-02-08