Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7830006 | Structurally-enhanced integrated circuit package and method of manufacture | Ravi Kanth Kolan, Hien Boon Tan, Anthony Yi Sheng Sun, Krishnamoorthi Sivalingam | 2010-11-09 |