Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9228860 | Sensor and method of providing a sensor | Virgil Ararao, Leonardo T. Magpantay, Raymond W. Engle, William P. Taylor, Kirsten Doogue +1 more | 2016-01-05 |
| 8785250 | Methods and apparatus for flip-chip-on-lead semiconductor package | Virgil Ararao | 2014-07-22 |
| 8486755 | Magnetic field sensors and methods for fabricating the magnetic field sensors | Virgil Ararao, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor +1 more | 2013-07-16 |
| 8461677 | Magnetic field sensors and methods for fabricating the magnetic field sensors | Virgil Ararao, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor +1 more | 2013-06-11 |
| 8344301 | Rapid and homogenous heat treatment of large metallic sample using high power microwaves | Kulvir Singh, Jaipal Reddy Gurram, Swaminathan Gopalan | 2013-01-01 |
| 8143169 | Methods for multi-stage molding of integrated circuit package | Raymond W. Engel, William P. Taylor | 2012-03-27 |
| 7816772 | Methods and apparatus for multi-stage molding of integrated circuit package | Raymond W. Engel, William P. Taylor | 2010-10-19 |
| 7361531 | Methods and apparatus for Flip-Chip-On-Lead semiconductor package | Virgil Ararao | 2008-04-22 |
| 6995315 | Current sensor | Richard Dickinson, Michael C. Doogue, Jay Gagnon | 2006-02-07 |
| 6861283 | Package for integrated circuit with thermal vias and method thereof | — | 2005-03-01 |
| 6809416 | Package for integrated circuit with thermal vias and method thereof | — | 2004-10-26 |
| 6646343 | Matched impedance bonding technique in high-speed integrated circuits | Ge Gong, Jason Chen | 2003-11-11 |
| 6420779 | Leadframe based chip scale package and method of producing the same | Rahamat Bidin, Hien Boon Tan | 2002-07-16 |
| 4731701 | Integrated circuit package with thermal path layers incorporating staggered thermal vias | Marco K. Kuo | 1988-03-15 |