Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package | Hien Boon Tan, Anthony Yi Sheng Sun | 2008-01-29 |
| 7109570 | Integrated circuit package with leadframe enhancement and method of manufacturing the same | Rodel Manalac, Hien Boon Tan, Jaime Siat, Roland Cordero | 2006-09-19 |