Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8247272 | Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process | Yong Chuan Koh, Jimmy SIAT, Jeffrey Nantes Salamat, Lope Vallespin Pepito, Jr., Rodel Manalac +2 more | 2012-08-21 |