| 6468831 |
Method of fabricating thin integrated circuit units |
Chew Weng Leong, Chee Kiang Yew, Min Yu Chan, Pang Hup Ong, Jeffrey Toh |
2002-10-22 |
| 6387729 |
Method for adhering and sealing a silicon chip in an integrated circuit package |
Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Tuck Fook Toh +2 more |
2002-05-14 |
| 6365833 |
Integrated circuit package |
Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Tuck Fook Toh +2 more |
2002-04-02 |
| 6274929 |
Stacked double sided integrated circuit package |
Chew Weng Leong, Chee Kiang Yew, Min Yu Chan, Pang Hup Ong, Jeffrey Toh |
2001-08-14 |
| 6177723 |
Integrated circuit package and flat plate molding process for integrated circuit package |
Kian Teng Eng, Min Yu Chan, Jing Sua Goh |
2001-01-23 |
| 6087203 |
Method for adhering and sealing a silicon chip in an integrated circuit package |
Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Tuck Fook Toh +2 more |
2000-07-11 |
| 5998860 |
Double sided single inline memory module |
Kian Teng Eng |
1999-12-07 |