Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468831 | Method of fabricating thin integrated circuit units | Chew Weng Leong, Chee Kiang Yew, Min Yu Chan, Pang Hup Ong, Jeffrey Toh | 2002-10-22 |
| 6387729 | Method for adhering and sealing a silicon chip in an integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Tuck Fook Toh +2 more | 2002-05-14 |
| 6365833 | Integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Tuck Fook Toh +2 more | 2002-04-02 |
| 6274929 | Stacked double sided integrated circuit package | Chew Weng Leong, Chee Kiang Yew, Min Yu Chan, Pang Hup Ong, Jeffrey Toh | 2001-08-14 |
| 6177723 | Integrated circuit package and flat plate molding process for integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh | 2001-01-23 |
| 6087203 | Method for adhering and sealing a silicon chip in an integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low, Tuck Fook Toh +2 more | 2000-07-11 |
| 5998860 | Double sided single inline memory module | Kian Teng Eng | 1999-12-07 |