Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6617201 | U-shape tape for BOC FBGA package to improve moldability | Lim Thiam Chye, Lee Choon Kuan, Jeffrey Toh, Patrick Guay, Choong L. Wah | 2003-09-09 | $3,971,000 |
| 6486536 | U-shape tape for BOC FBGA package to improve moldability | Lim Thiam Chye, Lee Choon Kuan, Jeffery Toh, Patrick Guay, Choong L. Wah | 2002-11-26 | $5,696,000 |