Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › U-shape tape for BOC FBGA package to improve moldability

U-shape tape for BOC FBGA package to improve moldability

US Patent 6486536 · Granted Nov 26, 2002

Estimated economic value: $5,696,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Carrierless chip package for integrated circuit devices, and methods of making s2017
Land grid array semiconductor device packages2016
Semiconductor device assemblies including face-to-face semiconductor dice and re2016
Methods of forming integrated circuit packages2014
Integrated circuit packages2013
Apparatus and methods for forming wire bonds2013
Semiconductor device assemblies including face-to-face semiconductor dice and sy2013
Semiconductor device packages and assemblies2012
Methods of forming integrated circuit packages, and methods of assembling integr2011
Electronic devices including conductive vias having two or more conductive eleme2010
Methods of assembling integrated circuit packages2010
Build-up-package for integrated circuit devices, and methods of making same2010