Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7528007 | Methods for assembling semiconductor devices and interposers | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Keith Tan, Patrick Guay +3 more | 2009-05-05 |
| 7274095 | Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Keith Tan, Patrick Guay +3 more | 2007-09-25 |
| 6864166 | Method of manufacturing wire bonded microelectronic device assemblies | Lim Thiam Chye | 2005-03-08 |
| 6746894 | Ball grid array interposer, packages and methods | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Keith Tan, Patrick Guay +3 more | 2004-06-08 |
| 6650013 | Method of manufacturing wire bonded microelectronic device assemblies | Lim Thiam Chye | 2003-11-18 |