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Home › Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled

Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled

US Patent 6870247 · Granted Mar 22, 2005

Estimated economic value: $1,900,000 ⓘ

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