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Home › Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods

Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods

US Patent 7947529 · Granted May 24, 2011

Estimated economic value: $4,812,000 ⓘ

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