Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811278 | Method for packaging circuits | Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang | 2020-10-20 |
| 10453704 | Method for packaging circuits | Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang | 2019-10-22 |
| 9484225 | Method for packaging circuits | Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang | 2016-11-01 |
| 8629054 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Eng Meow Koon, Chia Yong Poo | 2014-01-14 |
| 8138617 | Apparatus and method for packaging circuits | Chia Yong Poo, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon +4 more | 2012-03-20 |
| 8115306 | Apparatus and method for packaging circuits | Chia Yong Poo, Low Siu Waf, Chan Min Yu, Neo Yong Lou, Eng Meow Koon +4 more | 2012-02-14 |
| 8008126 | Castellation wafer level packaging of integrated circuit chips | Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more | 2011-08-30 |
| 7947529 | Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods | Eng Meow Koon, Chia Yong Poo, Tay Wuu Yean | 2011-05-24 |
| 7679179 | Castellation wafer level packaging of integrated circuit chips | Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more | 2010-03-16 |
| 7675169 | Apparatus and method for packaging circuits | Chia Yong Poo, Low Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon +4 more | 2010-03-09 |
| 7528477 | Castellation wafer level packaging of integrated circuit chips | Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more | 2009-05-05 |
| 7358154 | Method for fabricating packaged die | Chia Yong Poo, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon +4 more | 2008-04-15 |
| 7285850 | Support elements for semiconductor devices with peripherally located bond pads | Chia Yong Poo, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Chua Swee Kwang | 2007-10-23 |
| 7276387 | Castellation wafer level packaging of integrated circuit chips | Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more | 2007-10-02 |
| 7226809 | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods | Chia Yong Poo, Chua Swee Kwang, Low Siu Waf, Chan Min Yu, Neo Yong Loo | 2007-06-05 |
| 7115984 | Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices | Chia Yong Poo, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Chua Swee Kwang | 2006-10-03 |
| 6949407 | Castellation wafer level packaging of integrated circuit chips | Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more | 2005-09-27 |
| 6894386 | Apparatus and method for packaging circuits | Chia Yong Poo, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon +4 more | 2005-05-17 |
| 6855572 | Castellation wafer level packaging of integrated circuit chips | Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more | 2005-02-15 |
| 6841418 | Multi-substrate microelectronic packages and methods for manufacture | Chia Yong Poo, Low Siu Waf | 2005-01-11 |
| 6818977 | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages | Chia Yong Poo, Chua Swee Kwang, Low Siu Waf, Chan Min Yu, Neo Yong Loo | 2004-11-16 |
| 6790706 | Apparatus and method for leadless packaging of semiconductor devices | Chia Yong Poo, Low Siu Waf | 2004-09-14 |
| 6787894 | Apparatus and method for leadless packaging of semiconductor devices | Chia Yong Poo, Low Siu Waf | 2004-09-07 |
| 6750547 | Multi-substrate microelectronic packages and methods for manufacture | Chia Yong Poo, Low Siu Waf | 2004-06-15 |
| 6747348 | Apparatus and method for leadless packaging of semiconductor devices | Chia Yong Poo, Low Siu Waf | 2004-06-08 |