Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6743696 | Apparatus and method for leadless packaging of semiconductor devices | Chia Yong Poo, Low Siu Waf | 2004-06-01 |
| 6727116 | Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods | Chia Yong Poo, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Chua Swee Kwang | 2004-04-27 |
| 6611052 | Wafer level stackable semiconductor package | Chia Yong Poo, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Chua Swee Kwang | 2003-08-26 |
| 6582992 | Stackable semiconductor package and wafer level fabrication method | Chia Yong Poo, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Chua Swee Kwang | 2003-06-24 |