CP

Chia Yong Poo

RR Round Rock Research: 2 patents #110 of 239Top 50%
📍 Singapore, SG: #108 of 13,971 inventorsTop 1%
Overall (All Time): #79,625 of 4,157,543Top 2%
40
Patents All Time

Issued Patents All Time

Showing 1–25 of 40 patents

Patent #TitleCo-InventorsDate
10811278 Method for packaging circuits Low Siu Waf, Boon Suan Jeung, Eng Meow Koon, Chua Swee Kwang 2020-10-20
10453704 Method for packaging circuits Low Siu Waf, Boon Suan Jeung, Eng Meow Koon, Chua Swee Kwang 2019-10-22
9484225 Method for packaging circuits Low Siu Waf, Boon Suan Jeung, Eng Meow Koon, Chua Swee Kwang 2016-11-01
8637973 Packaged microelectronic components with terminals exposed through encapsulant Eng Meow Koon, Low Siu Waf, Chan Min Yu, Ser Bok Leng, Zhou Wei 2014-01-28
8629054 Packaged semiconductor assemblies and methods for manufacturing such assemblies Boon Suan Jeung, Eng Meow Koon 2014-01-14
8174105 Stacked semiconductor package having discrete components Chua Swee Kwang 2012-05-08
8138617 Apparatus and method for packaging circuits Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon +4 more 2012-03-20
8115306 Apparatus and method for packaging circuits Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Lou, Eng Meow Koon +4 more 2012-02-14
8008126 Castellation wafer level packaging of integrated circuit chips Boon Suan Jeung, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more 2011-08-30
7964946 Semiconductor package having discrete components and system containing the package Chua Swee Kwang 2011-06-21
7947529 Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods Eng Meow Koon, Boon Suan Jeung, Tay Wuu Yean 2011-05-24
7807502 Method for fabricating semiconductor packages with discrete components Chua Swee Kwang 2010-10-05
7781877 Packaged integrated circuit devices with through-body conductive vias, and methods of making same Tongbi Jiang 2010-08-24
7723831 Semiconductor package having die with recess and discrete component embedded within the recess Chua Swee Kwang 2010-05-25
7679179 Castellation wafer level packaging of integrated circuit chips Boon Suan Jeung, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more 2010-03-16
7675169 Apparatus and method for packaging circuits Boon Suan Jeung, Low Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon +4 more 2010-03-09
7528477 Castellation wafer level packaging of integrated circuit chips Boon Suan Jeung, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more 2009-05-05
7358154 Method for fabricating packaged die Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon +4 more 2008-04-15
7285850 Support elements for semiconductor devices with peripherally located bond pads Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Chua Swee Kwang 2007-10-23
7276387 Castellation wafer level packaging of integrated circuit chips Boon Suan Jeung, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more 2007-10-02
7226809 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods Boon Suan Jeung, Chua Swee Kwang, Low Siu Waf, Chan Min Yu, Neo Yong Loo 2007-06-05
7195957 Packaged microelectronic components Eng Meow Koon, Low Siu Waf, Chan Min Yu, Ser Bok Leng, Zhou Wei 2007-03-27
7170161 In-process semiconductor packages with leadframe grid arrays Chan Min Yu, Ser Bok Leng, Low Siu Waf, Eng Meow Koon 2007-01-30
7115984 Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Chua Swee Kwang 2006-10-03
6967127 Methods for making semiconductor packages with leadframe grid arrays Chan Min Yu, Ser Bok Leng, Low Siu Waf, Eng Meow Koon 2005-11-22