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Home › Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

US Patent 7745944 · Granted Jun 29, 2010

Estimated economic value: $3,072,000 ⓘ

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