Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same

Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same

US Patent 7075816 · Granted Jul 11, 2006

Estimated economic value: $2,452,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of forming integrated circuit packages2014
Methods of forming integrated circuit packages2014
Microelectronic devices having intermediate contacts for connection to interpose2014
Integrated circuit packages2013
Integrated circuit packages2013
Microelectronic devices having intermediate contacts for connection to interpose2012
Methods of forming integrated circuit packages, and methods of assembling integr2011
Methods of forming integrated circuit packages, and methods of assembling integr2011
Microelectronic devices having intermediate contacts for connection to interpose2010
Methods of assembling integrated circuit packages2010
Methods of assembling integrated circuit packages2010
Semiconductor device assemblies and packages including multiple semiconductor de2009