Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8399297 | Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages | Tay Wuu Yean | 2013-03-19 |
| 8072082 | Pre-encapsulated cavity interposer | Tay Wuu Yean | 2011-12-06 |