Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7550315 | Method for fabricating semiconductor package with multi-layer die contact and external contact | Lee Kian Chai | 2009-06-23 |
| 7145228 | Microelectronic devices | Tay Wuu Yean | 2006-12-05 |
| 6946325 | Methods for packaging microelectronic devices | Tay Wuu Yean | 2005-09-20 |