Issued Patents All Time
Showing 1–25 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087738 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Tongbi Jiang | 2024-09-10 |
| 11594525 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Tongbi Jiang | 2023-02-28 |
| 11398457 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Tongbi Jiang | 2022-07-26 |
| 10622308 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Suan Jeung Boon, Meow Koon Eng | 2020-04-14 |
| 10593653 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Tongbi Jiang | 2020-03-17 |
| 10431531 | Semiconductor dies with recesses, associated leadframes, and associated systems and methods | Chua Swee Kwang | 2019-10-01 |
| 10396059 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon | 2019-08-27 |
| 10074599 | Semiconductor dies with recesses, associated leadframes, and associated systems and methods | Chua Swee Kwang | 2018-09-11 |
| 10056359 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon | 2018-08-21 |
| 9911696 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Suan Jeung Boon, Meow Koon Eng | 2018-03-06 |
| 9679834 | Semiconductor dies with recesses, associated leadframes, and associated systems and methods | Chua Swee Kwang | 2017-06-13 |
| 9653444 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon | 2017-05-16 |
| 9418872 | Packaged microelectronic components | Meow Koon Eng, Sui Waf Low, Min Yu Chan, Bok Leng Ser, Wei Zhou | 2016-08-16 |
| 9165910 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon | 2015-10-20 |
| 9099571 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Tongbi Jiang | 2015-08-04 |
| 8906744 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon | 2014-12-09 |
| 8723307 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Tongbi Jiang | 2014-05-13 |
| 8698295 | Super high-density module with integrated wafer level packages | Suan Jeung Boon, Siu Waf Low, Yong Loo Neo, Bok Leng Ser | 2014-04-15 |
| 8564106 | Wafer level packaging | Swee Kwang Chua, Suan Jeung Boon, Yong Loo Neo | 2013-10-22 |
| 8555495 | Method for packaging circuits | Low Siu Waf, Suan Jeung Boon, Eng Meow Koon, Swee Kwang Chua | 2013-10-15 |
| 8536702 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon | 2013-09-17 |
| 8525320 | Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon, Wuu Yean Tay | 2013-09-03 |
| 8445330 | Interconnects for packaged semiconductor devices and methods for manufacturing such devices | Suan Jeung Boon, Meow Koon Eng | 2013-05-21 |
| 8362594 | Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material | Swee Kwang Chua, Suan Jeung Boon | 2013-01-29 |
| 8304894 | Super high-density module with integrated wafer level packages | Suan Jeung Boon, Siu Waf Low, Yong Loo Neo, Bok Leng Ser | 2012-11-06 |