Issued Patents All Time
Showing 51–58 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7112471 | Leadless packaging for image sensor devices and methods of assembly | Suan Jeung Boon, Yong Loo Neo, Swee Kwang Chua, Siu Waf Low | 2006-09-26 |
| 7087992 | Multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Siu Waf Low, Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon +2 more | 2006-08-08 |
| 6987031 | Multiple chip semiconductor package and method of fabricating same | Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more | 2006-01-17 |
| 6964881 | Multi-chip wafer level system packages and methods of forming same | Swee Kwang Chua, Siu Waf Low, Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon +2 more | 2005-11-15 |
| 6958537 | Multiple chip semiconductor package | Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more | 2005-10-25 |
| 6882021 | Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead | Suan Jeung Boon, Min Yu Chan, Meow Koon Eng, Siu Waf Low, Swee Kwang Chua | 2005-04-19 |
| 6856155 | Methods and apparatus for testing and burn-in of semiconductor devices | Wuu Yean Tay, Yong Kian Tan, Siu Waf Low, Suan Jeung Boon, Soon Huat Goh | 2005-02-15 |
| 6825553 | Multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Siu Waf Low, Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon +2 more | 2004-11-30 |