Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7820459 | Methods relating to the reconstruction of semiconductor wafers for wafer level processing including forming of alignment protrusion and removal of alignment material | Wuu Yean Tay | 2010-10-26 |
| 7573006 | Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing | Wuu Yean Tay | 2009-08-11 |
| 7425462 | Methods relating to the reconstruction of semiconductor wafers for wafer-level processing | Wuu Yean Tay | 2008-09-16 |
| 7190074 | Reconstructed semiconductor wafers including alignment droplets contacting alignment vias | Wuu Yean Tay | 2007-03-13 |
| 7112048 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan +4 more | 2006-09-26 |
| 7071012 | Methods relating to the reconstruction of semiconductor wafers for wafer-level processing | Wuu Yean Tay | 2006-07-04 |
| 6856155 | Methods and apparatus for testing and burn-in of semiconductor devices | Wuu Yean Tay, Yong Poo Chia, Siu Waf Low, Suan Jeung Boon, Soon Huat Goh | 2005-02-15 |
| 6720666 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan +4 more | 2004-04-13 |
| 6692987 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan +4 more | 2004-02-17 |