Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7112048 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kian Lee, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more | 2006-09-26 |
| 6720666 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kian Lee, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more | 2004-04-13 |
| 6692987 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kian Lee, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more | 2004-02-17 |