Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8232657 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Suan Jeung Boon, Meow Koon Eng | 2012-07-31 |
| 8198720 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon | 2012-06-12 |
| 8106488 | Wafer level packaging | Swee Kwang Chua, Suan Jeung Boon, Neo Yong Loo | 2012-01-31 |
| 8065792 | Method for packaging circuits | Low Siu Waf, Suan Jeung Boon, Eng Meow Koon, Swee Kwang Chua | 2011-11-29 |
| 8063493 | Semiconductor device assemblies and packages | Suan Jeung Boon, Meow Koon Eng, Siu Waf Low | 2011-11-22 |
| 7884007 | Super high density module with integrated wafer level packages | Suan Jeung Boon, Siu Waf Low, Yong Loo Neo, Bok Leng Ser | 2011-02-08 |
| 7855462 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Suan Jeung Boon, Meow Koon Eng | 2010-12-21 |
| 7843050 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon | 2010-11-30 |
| 7820484 | Wafer level packaging | Swee Kwang Chua, Suan Jeung Boon, Yong Loo Neo | 2010-10-26 |
| 7791203 | Interconnects for packaged semiconductor devices and methods for manufacturing such devices | Suan Jeung Boon, Meow Koon Eng | 2010-09-07 |
| 7712211 | Method for packaging circuits and packaged circuits | Low Siu Waf, Suan Jeung Boon, Eng Meow Koon, Swee Kwang Chua | 2010-05-11 |
| 7674655 | Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material | Swee Kwang Chua, Suan Jeung Boon | 2010-03-09 |
| 7659134 | Microelectronic imagers and methods for manufacturing such microelectronic imagers | Yong Loo Neo, Meow Koon Eng | 2010-02-09 |
| 7633159 | Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages | Suan Jeung Boon, Meow Koon Eng, Siu Waf Low | 2009-12-15 |
| 7579681 | Super high density module with integrated wafer level packages | Suan Jeung Boon, Siu Waf Low, Yong Loo Neo, Bok Leng Ser | 2009-08-25 |
| 7553697 | Multiple chip semiconductor package | Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more | 2009-06-30 |
| 7485562 | Method of making multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Siu Waf Low, Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon +2 more | 2009-02-03 |
| 7375009 | Method of forming a conductive via through a wafer | Swee Kwang Chua, Suan Jeung Boon, Yong Loo Neo | 2008-05-20 |
| 7368374 | Super high density module with integrated wafer level packages | Suan Jeung Boon, Siu Waf Low, Yong Loo Neo, Bok Leng Ser | 2008-05-06 |
| 7304375 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Siu Waf Low, Meow Koon Eng, Swee Kwang Chua, Shuang Wu Huang +2 more | 2007-12-04 |
| 7274094 | Leadless packaging for image sensor devices | Suan Jeung Boon, Yong Loo Neo, Swee Kwang Chua, Siu Waf Low | 2007-09-25 |
| 7271027 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Siu Waf Low, Meow Koon Eng, Swee Chua, Shuang Wu Huang +2 more | 2007-09-18 |
| 7208335 | Castellated chip-scale packages and methods for fabricating the same | Suan Jeung Boon, Meow Koon Eng, Siu Waf Low | 2007-04-24 |
| 7193312 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Siu Waf Low, Meow Koon Eng, Swee Kwang Chua, Shuang Wu Huang +2 more | 2007-03-20 |
| 7173330 | Multiple chip semiconductor package | Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more | 2007-02-06 |