Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8698295 | Super high-density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Bok Leng Ser | 2014-04-15 |
| 8564106 | Wafer level packaging | Swee Kwang Chua, Suan Jeung Boon, Yong Poo Chia | 2013-10-22 |
| 8304894 | Super high-density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Bok Leng Ser | 2012-11-06 |
| 7884007 | Super high density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Bok Leng Ser | 2011-02-08 |
| 7820484 | Wafer level packaging | Swee Kwang Chua, Suan Jeung Boon, Yong Poo Chia | 2010-10-26 |
| 7659134 | Microelectronic imagers and methods for manufacturing such microelectronic imagers | Yong Poo Chia, Meow Koon Eng | 2010-02-09 |
| 7579681 | Super high density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Bok Leng Ser | 2009-08-25 |
| 7553697 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more | 2009-06-30 |
| 7485562 | Method of making multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Suan Jeung Boon +2 more | 2009-02-03 |
| 7375009 | Method of forming a conductive via through a wafer | Swee Kwang Chua, Suan Jeung Boon, Yong Poo Chia | 2008-05-20 |
| 7368374 | Super high density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Bok Leng Ser | 2008-05-06 |
| 7304375 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Meow Koon Eng, Swee Kwang Chua +2 more | 2007-12-04 |
| 7274094 | Leadless packaging for image sensor devices | Suan Jeung Boon, Yong Poo Chia, Swee Kwang Chua, Siu Waf Low | 2007-09-25 |
| 7271027 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Meow Koon Eng, Swee Chua +2 more | 2007-09-18 |
| 7193312 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Meow Koon Eng, Swee Kwang Chua +2 more | 2007-03-20 |
| 7173330 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more | 2007-02-06 |
| 7112471 | Leadless packaging for image sensor devices and methods of assembly | Suan Jeung Boon, Yong Poo Chia, Swee Kwang Chua, Siu Waf Low | 2006-09-26 |
| 7087992 | Multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Suan Jeung Boon +2 more | 2006-08-08 |
| 6987031 | Multiple chip semiconductor package and method of fabricating same | Meow Koon Eng, Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more | 2006-01-17 |
| 6964881 | Multi-chip wafer level system packages and methods of forming same | Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Suan Jeung Boon +2 more | 2005-11-15 |
| 6958537 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more | 2005-10-25 |
| 6825553 | Multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Suan Jeung Boon +2 more | 2004-11-30 |