YN

Yong Loo Neo

Micron: 21 patents #832 of 6,345Top 15%
AI Aptina Imaging: 1 patents #187 of 332Top 60%
Overall (All Time): #197,253 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8698295 Super high-density module with integrated wafer level packages Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Bok Leng Ser 2014-04-15
8564106 Wafer level packaging Swee Kwang Chua, Suan Jeung Boon, Yong Poo Chia 2013-10-22
8304894 Super high-density module with integrated wafer level packages Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Bok Leng Ser 2012-11-06
7884007 Super high density module with integrated wafer level packages Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Bok Leng Ser 2011-02-08
7820484 Wafer level packaging Swee Kwang Chua, Suan Jeung Boon, Yong Poo Chia 2010-10-26
7659134 Microelectronic imagers and methods for manufacturing such microelectronic imagers Yong Poo Chia, Meow Koon Eng 2010-02-09
7579681 Super high density module with integrated wafer level packages Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Bok Leng Ser 2009-08-25
7553697 Multiple chip semiconductor package Meow Koon Eng, Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more 2009-06-30
7485562 Method of making multichip wafer level packages and computing systems incorporating same Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Suan Jeung Boon +2 more 2009-02-03
7375009 Method of forming a conductive via through a wafer Swee Kwang Chua, Suan Jeung Boon, Yong Poo Chia 2008-05-20
7368374 Super high density module with integrated wafer level packages Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Bok Leng Ser 2008-05-06
7304375 Castellation wafer level packaging of integrated circuit chips Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Meow Koon Eng, Swee Kwang Chua +2 more 2007-12-04
7274094 Leadless packaging for image sensor devices Suan Jeung Boon, Yong Poo Chia, Swee Kwang Chua, Siu Waf Low 2007-09-25
7271027 Castellation wafer level packaging of integrated circuit chips Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Meow Koon Eng, Swee Chua +2 more 2007-09-18
7193312 Castellation wafer level packaging of integrated circuit chips Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Meow Koon Eng, Swee Kwang Chua +2 more 2007-03-20
7173330 Multiple chip semiconductor package Meow Koon Eng, Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more 2007-02-06
7112471 Leadless packaging for image sensor devices and methods of assembly Suan Jeung Boon, Yong Poo Chia, Swee Kwang Chua, Siu Waf Low 2006-09-26
7087992 Multichip wafer level packages and computing systems incorporating same Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Suan Jeung Boon +2 more 2006-08-08
6987031 Multiple chip semiconductor package and method of fabricating same Meow Koon Eng, Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more 2006-01-17
6964881 Multi-chip wafer level system packages and methods of forming same Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Suan Jeung Boon +2 more 2005-11-15
6958537 Multiple chip semiconductor package Meow Koon Eng, Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more 2005-10-25
6825553 Multichip wafer level packages and computing systems incorporating same Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Suan Jeung Boon +2 more 2004-11-30