Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8163643 | Enhanced pad design for solder attach devices | Maurice Othieno, Frederick E. Beville, David Alan Pruitt, William D. Griffitts | 2012-04-24 |
| 7531442 | Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing | Jayanthi Pallinti, Dilip Vijay, Hemanshu Bhatt, Sey-Shing Sun, Hong Ying +3 more | 2009-05-12 |
| 6998638 | Test structure for detecting bonding-induced cracks | Qwai H. Low, Anwar Ali, Tauman T. Lau | 2006-02-14 |
| 6991147 | Insulated bonding wire tool for microelectronic packaging | Chok J. Chia, Owai H. Low | 2006-01-31 |
| 6963138 | Dielectric stack | Qwai H. Low, Chok J. Chia, Tauman T. Lau | 2005-11-08 |
| 6861343 | Buffer metal layer | Chok J. Chia, Qwai H. Low | 2005-03-01 |
| 6861748 | Test structure | Qwai H. Low, Rey Torcuato | 2005-03-01 |
| 6825563 | Slotted bonding pad | Maurice Othieno, Qwai H. Low | 2004-11-30 |
| 6798035 | Bonding pad for low k dielectric | Qwai H. Low, Edwin M. Fulcher | 2004-09-28 |
| 6781150 | Test structure for detecting bonding-induced cracks | Qwai H. Low, Anwar Ali, Tauman T. Lau | 2004-08-24 |
| 6743979 | Bonding pad isolation | Michael Berman, Aftab Ahmad, Qwai H. Low, Chok J. Chia | 2004-06-01 |
| 6670214 | Insulated bonding wire for microelectronic packaging | Chok J. Chia, Owai H. Low | 2003-12-30 |
| 6573113 | Integrated circuit having dedicated probe pads for use in testing densely patterned bonding pads | Qwai H. Low, William T. Bright | 2003-06-03 |
| 6486002 | Tape design to reduce warpage | Qwai H. Low, Sengsooi Lim | 2002-11-26 |
| 6425179 | Method for assembling tape ball grid arrays | Qwai H. Low, Chok J. Chia | 2002-07-30 |
| 6329278 | Multiple row wire bonding with ball bonds of outer bond pads bonded on the leads | Qwai H. Low, Rey Torcuato | 2001-12-11 |
| 6266249 | Semiconductor flip chip ball grid array package | Kishor Desai, Sunil A. Patel | 2001-07-24 |
| 6020221 | Process for manufacturing a semiconductor device having a stiffener member | Sengsooi Lim, Sunil A. Patel | 2000-02-01 |
| 5457880 | Embedded features for monitoring electronics assembly manufacturing processes | Philip E. McKinley, Carl J. Bloch | 1995-10-17 |
| 5385289 | Embedded features for registration measurement in electronics manufacturing | Carl J. Bloch, Philip E. McKinley | 1995-01-31 |