Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6991147 | Insulated bonding wire tool for microelectronic packaging | Chok J. Chia, Ramaswamy Ranganathan | 2006-01-31 |
| 6670214 | Insulated bonding wire for microelectronic packaging | Chok J. Chia, Ramaswamy Ranganathan | 2003-12-30 |
| 6002169 | Thermally enhanced tape ball grid array package | Chok J. Chia, Seng-Sooi Lim | 1999-12-14 |