Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11533813 | Touchscreen display panel gripping mechanism and bezel | Cheyenne Matthews, Jason A. Myren, Michael P. Matessa, Devin Elbert, Richard T. Stone +1 more | 2022-12-20 |
| 10292278 | Compact printed circuit board assembly with insulating endcap via | Thomas Lee Schick, Robert A. Matousek | 2019-05-14 |
| 9888360 | Methods to optimize and streamline AP placement on floor plan | Abhinav Sharma, Murthy S. Vempati, Saumitra Mohan Das, Chandrakant Mehta, Rupali T. Desai | 2018-02-06 |
| 7383049 | Automation of maintenance and improvement of location service parameters in a data base of a wireless mobile communication system | James Douglass DeLoach, Jr., Alkinoos Vayanos, Bruce G. Wilson, Richard Girerd, Grant Alexander Marshall +5 more | 2008-06-03 |
| 6618938 | Interposer for semiconductor package assembly | Maniam Alagaratnam, Kishor Desai | 2003-09-16 |
| 6466038 | Non-isothermal electromigration testing of microelectronic packaging interconnects | Senol Pekin | 2002-10-15 |
| 6433565 | Test fixture for flip chip ball grid array circuits | Kishor Desai, Maniam Alagaratnam | 2002-08-13 |
| 6335491 | Interposer for semiconductor package assembly | Maniam Alagaratnam, Kishor Desai | 2002-01-01 |
| 6306751 | Apparatus and method for improving ball joints in semiconductor packages | Chok J. Chia, Kishor Desai | 2001-10-23 |
| 6266249 | Semiconductor flip chip ball grid array package | Kishor Desai, Ramaswamy Ranganathan | 2001-07-24 |
| 6166434 | Die clip assembly for semiconductor package | Kishor Desai, John McCormick | 2000-12-26 |
| 6020221 | Process for manufacturing a semiconductor device having a stiffener member | Sengsooi Lim, Ramaswamy Ranganathan | 2000-02-01 |
| 6002171 | Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package | Kishor Desai, John McCormick | 1999-12-14 |
| 5998242 | Vacuum assisted underfill process and apparatus for semiconductor package fabrication | Galen Kirkpatrick, Manickam Thavarajah, Stephen A. Murphy | 1999-12-07 |
| 5909057 | Integrated heat spreader/stiffener with apertures for semiconductor package | John McCormick | 1999-06-01 |