Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749576 | Stacked circuit package with molded base having laser drilled openings for upper package | John David Brazzle, Frederick E. Beville, David R. Ng, Michael J. Anderson | 2023-09-05 |
| 11410977 | Electronic module for high power applications | John David Brazzle, Frederick E. Beville, Zafer Kutlu | 2022-08-09 |
| 10497635 | Stacked circuit package with molded base having laser drilled openings for upper package | John David Brazzle, Frederick E. Beville, David R. Ng, Michael J. Anderson | 2019-12-03 |
| 7791321 | Coupled-inductor multi-phase buck converters | Ming Xu, Fred C. Lee | 2010-09-07 |