Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7804167 | Wire bond integrated circuit package for high speed I/O | Abiola Awujoola, Leonard L. Mora, Amar Amin, Maurice Othieno, Chok J. Chia | 2010-09-28 |
| 7750460 | Ball grid array package layout supporting many voltage splits and flexible split locations | Abiola Awujoola, Leonard L. Mora | 2010-07-06 |
| 7166492 | Integrated circuit carrier apparatus method and system | Abiola Awujoola | 2007-01-23 |
| 6654248 | Top gated heat dissipation | Maurice Othieno | 2003-11-25 |
| 6540467 | Apparatus and method of semiconductor wafer protection | Nael Zohni | 2003-04-01 |
| 5786631 | Configurable ball grid array package | Michael L. Lofstedt | 1998-07-28 |