Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7804167 | Wire bond integrated circuit package for high speed I/O | Clifford R. Fishley, Abiola Awujoola, Amar Amin, Maurice Othieno, Chok J. Chia | 2010-09-28 |
| 7750460 | Ball grid array package layout supporting many voltage splits and flexible split locations | Clifford R. Fishley, Abiola Awujoola | 2010-07-06 |
| 6891260 | Integrated circuit package substrate with high density routing mechanism | Abi Awujoola | 2005-05-10 |
| 6777802 | Integrated circuit package substrate with multiple voltage supplies | Abi Awujoola, Ed Fulcher | 2004-08-17 |
| 6748576 | Active trace rerouting | Abiola Awujoola, Jeffrey A. Hall | 2004-06-08 |
| 6479319 | Contact escape pattern | Farshad Ghahghahi | 2002-11-12 |
| 6264778 | Reinforced sealing technique for an integrated circuit package | Ahmad Hamzehdoost | 2001-07-24 |
| 5687474 | Method of assembling and cooling a package structure with accessible chip | Ahmad Hamzehdoost | 1997-11-18 |
| 5539151 | Reinforced sealing technique for an integrated-circuit package | Ahmad Hamzehdoost | 1996-07-23 |
| 5491362 | Package structure having accessible chip | Ahmad Hamzehdoost | 1996-02-13 |