Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8946871 | Thermal improvement of integrated circuit packages | Zeki Z. Celik, Atila Mertol | 2015-02-03 |
| 8370777 | Method of generating a leadframe IC package model, a leadframe modeler and an IC design system | Donald E. Hawk, Stephen M. King, Jeffrey Klemovage, John J. Krantz, Ashley Rebelo +1 more | 2013-02-05 |
| 7327043 | Two layer substrate ball grid array design | Chok J. Chia, Maurice Othieno | 2008-02-05 |